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aktuelle Nachrichten
Apr
29
The difference between source crystals and passive crystals
The difference between the source of the source crystal and the passive crystal, there are any ways to quickly distinguish between the difference betw...
Apr
25
The difference between battery modules and PACK
Battery modules and battery packs (PACK) are two key components in the lithium -ion battery system. They play a vital role in electric vehicles, energ...
Apr
24
China's core rise: soaring output, technical breakout
一、Broken waves against the wind, China's core industry is singing high In this era of storms, the Chinese chip industry is like a dark horse, emergi...
Apr
23
11
China's semiconductor output rose 40%in the first quarter, and the total output reached 98.1 billion units, exceeding the expected growth rate. The re...
Apr
23
The N & S Electronic Procurement Department held a 2024 Q1 Awards & 2024 Q2 event
With the successful end of the first quarter of 2024, the N & S Electronic Procurement Department worked together and made aggressive in this quarter ...
Apr
22
The working principle and characteristics of infrared sensor
Infrared sensor is a non -contact photoelectric sensor that is used to detect changes in the existence of an object or the characteristics of the obje...
Apr
19
The advantage of infrared thermal imaging in the field of security
Security is an important issue for everyone to care about, especially in the context of uncertainty and risk increases in today's society. In order to...
Apr
18
s
With the continuous development of industrial automation, inverters, referred to as VFD and programmable logic controllers, referred to as PLC, have b...
Apr
17
What are the differences between the MCU classification? SOC chip and MCU chip difference
There are significant differences in SOC chips and MCU chips in multiple aspects. First of all, from the perspective of definition and integration, th...
Apr
16
Electronic component device static electricity protection
The electrostatic protection of electronic components is an important part of the reliability of electronic equipment. In electronic devices, the impa...
Apr
15
Organ chip technology: reshaping the subversive breakthrough of the future of medicine
Gu Zhongze, who developed organ chips, developed simulated human organs through 3D printing and nano -processing technology in the high -molecular mat...
Apr
12
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In recent years, some terminal manufacturers have begun to expand their own chip design in the field of chip design in the upstream reaches of the ups...
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Product Release
MAX1239LEEE+
IC ADC 12BIT SERIAL 16-QSOP
XC7A50T-L2CSG325E
IC FPGA 150 I/O 325CSBGA
LC4256C-5T100I
IC CPLD 256MC 5NS 100TQFP
SI5335D-B04492-GM
4-OUTPUT, ANY FREQUENCY(<200MHZ)
FS32K144MAT0CMHT
S32K144, 100 MAPBGA
MegaSource Co., LTD.